Honeywell Joins As Gold Sponsor of FAB Summit Europe

Honeywell will be joining Innovatrix as Gold Sponsors of our upcoming event, 2nd Constructing Semiconductor FAB Summit Europe: Advances In Planning, Design and Engineering, taking place October 21-22, 2025 in Munich, Germany.

Honeywell helps organizations solve the world’s most complex challenges in automation and energy transition. As a trusted partner, they provide actionable solutions and innovation through their Building Automation, Energy and Sustainability Solutions, and Industrial Automation business segments – powered by Honeywell Forge software – that help make the world smarter, safer and more sustainable.

Honeywell is a key supplier of electronic materials that support the digitalization revolution, including a critical part of the chip known as interconnects. Interconnects are the electronic links between the billions of transistors in a semiconductor. Honeywell is a supplier of Physical Vapor Deposition (PVD) sputtering targets metals, a key material in the interconnects in a semiconductor chip. 

Sputtering targets are made from various metals and alloys, such as copper, aluminum, titanium and more, which are refined to very high purity and processed to achieve very specific material properties so they can help high-performance chips function properly. Honeywell is the only US-based manufacturer of copper manganese sputtering targets, a key material used in the most advanced semiconductors. 

Each sputtering target provides the foundation (or seed) conductive layer for the interconnects. Without this foundation layer, semiconductor chips would not operate.

Honeywell is also a critical supplier of inorganic polymers used in the manufacture of advanced chips. Our polymers ensure the accurate layout of the interconnects in a chip and fill the extremely narrow gaps between interconnects and other features on a chip.

Honeywell also develops and manufactures a variety of thermal solutions which ensure high-performance chips do not overheat while they operate.

Honeywell has three major electronic materials centers focused on research and development, located in Spokane, Washington; Sunnyvale, California; and Shanghai, China. They have nearly 400 granted and pending patents for semiconductor materials.

Connect with Honeywell here to gain their expertise for your semiconductor fab plant design.

To meet with Honeywell and discuss your fab construction needs, network with peers and solution providers and attend talks from industry leaders, book your place to attend the 2nd Constructing Semiconductor FAB Summit Europe: Advances In Planning, Design and Engineering, taking place October 21-22, 2025 in Munich, Germany.

For more information, click here or email us at info@innovatrix.eu for the event agenda. Visit our LinkedIn to stay up to date on our latest speaker announcements and event news.

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